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MBH01-1T1AP
The MBH01-1T1AP HPM follows OCP DC-MHS specification to enable a common design for multi-node servers within modern data center.
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Key Features

Form Factor
Form Factor
Mainboard Form Factor
M-SDNO A335​
Mainboard Dimension (mm)
210 x 335
Processor
Processor
Number of Processors
1
Processor Type
Intel® Xeon® 6900P/6900E series CPU support​​
Socket E2: 7529 pins
Max. TDP Support
Up to 500W​
Memory
Memory
Total Slots
12 x DDR5 DIMM slots; 1DPC (1 DIMM per Channel)​​
Memory Type
DDR5 RDIMM: 6400MT/s as 1DPC​
-- 6900P series ​
MCR ( Multiplexer Combined Ranks ) : 8800MT/s as 1DPC​
Expansion Slots
Expansion Slots
SKU - #1 (若有不同SKU的時候)
2 x Multi-track PCIe Gen5 x16​
1 x DC-SCM 2.0
Other Specifications per System/Chassis
Other Specifications per System/Chassis
Other Specifications per System/Chassis Other Specifications per System/Chassis
PCIe Expansion Connectors
4 x MCIO (PCIe Gen5 x8)
PCIe Expansion Connectors 4 x MCIO (PCIe Gen5 x8)
Ethernet
1 x OCP NIC 3.0 (PCIe Gen5 x16)
Ethernet 1 x OCP NIC 3.0 (PCIe Gen5 x16)
Other connectors/ Headers
1 x GenZ 1C (PCIe Gen5 x4)​
1 x TPM header​​
1 x CMOS header
Other connectors/ Headers 1 x GenZ 1C (PCIe Gen5 x4)​
1 x TPM header​​
1 x CMOS header
Manual & Documents
Drivers & Downloads
Important Notice: Only perform BIOS/firmware updates when experiencing firmware-related issues. Improper firmware flashing may result in permanent system damage. Our company assumes no responsibility for any direct, indirect, special, incidental, or consequential damages resulting from firmware update procedures.

OR

Important Notice: Only perform BIOS/firmware updates when experiencing firmware-related issues. Improper firmware flashing may result in permanent system damage. Our company assumes no responsibility for any direct, indirect, special, incidental, or consequential damages resulting from firmware update procedures.
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