MS303-2A1G | ||
Chassis Form Factor | 2OU | |
Chassis Dimension (mm) | 537 (W) × 93.5 (H) × 809.25 (D) | |
Mainboard Form Factor | Half-width MB | |
Mainboard Dimension (mm) | 540 x 250 | |
Per Node Specifications | ||
Processor | Number of Processors | 2 |
Processor Type | AMD EPYC™ 9005 series processors | |
Max. TDP Support | 500W | |
GPU | NVIDIA HGX™ H200 4-GPU | |
Memory | Total Slots | 24 |
Memory Type | 1DPC: DDR5 RDIMM up to 6400 MT/s | |
DIMM Capacity (GB per DIMM) | 64GB, 96GB, 128GB | |
Expansion Slots | SKU - #1 (若有不同SKU的時候) | 2 x OCP 3.0 NIC x16 2 x OCP 3.0 NIC x8 2 x PCIe 5.0 ×16 (HHHL) |
Storage Bays | SKU - #1 | 2 x E1.S NVMe SSD (support hardware RAID 1 for OS) 8 x E3.S 1T NVMe SSD |
Management | Aspeed® AST2600 | |
Security |
TPM 2.0 PROT (optional module, ASPEED AST1060) |
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Networking Interface |
4 x OCP 3.0 NIC 1 x BMC management RJ45 (DC-SCM) 2 x RJ45 1GbE LAN (DC-SCM) |
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Front I/O Ports |
DC-SCM 2.0-like module (AST 2600) 1 x BMC management RJ45 2 x RJ45 1GbE LAN 1 x Micro USB 1 x USB 2.0 Type-C 1 x Mini display port 1 x Power button LED 1 x UID button LED 1 x BMC reset button 1 x System status button |
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OS Support |
Ubuntu 22.04 LTS and above RHEL 8.6 and above VMware ESXi8.0 Linux Enterprise Server (SLES): 15 SP5 and above Windows Server 2022 |
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Other Specifications per System/Chassis | ||
Power Supply | ORv3 48VDC Busbar | |
Fans | 2 x 9256 Fan + Direct Liquid Cooling | |
Operating Environment |
Operating Temperature: 0°C to 40°C Storage temperature range: -40°C to 68 °C Operating and Storage relative humidity: 10% to 90%, non-condensing |