Born for AI, PEGATRON Activates Your Imagination for High Performance Computing at SC 2024

Nov. 18th, 2024— PEGATRON, a globally recognized Electronics and Manufacturing Service (EMS+) provider will be participate in Supercomputing 2024 at booth No.403. With the theme of “Born for AI, Activate Your Imagination,” it will be showcasing the solutions for real-time large language model (LLM) computing and advanced thermal infrastructure. By introducing direct liquid cooled (DLC) server products designed for multi-node, high-density computing performance, PEGATRON is leading the way for data centers to improve energy efficiency.

Regarding to the theme of the SC24 exhibition, “HPC Creates,” PEGATRON will exhibit a series of server and rack-level solutions that is designed in cooperation with partners AMD, Intel, and NVIDIA to support high-performance computing. The booth’s main featured products include:

1. Supports large-scale generative AI computing racks (RA4401-72N1) and comes with liquid cooling options, including liquid-to-air sidecar or liquid-to-liquid CDU solutions. The NVIDIA GB200 NVL72 platform powers the new era of computing, delivering 30X faster real-time large language model (LLM) inference, 25X lower TCO, and 25X less energy.

2. The demand and importance of AI inference applications are increasing day by day. NVIDIA MGX™ is a modular reference architecture for scale out accelerated computing. PEGATRON uses this building-block approach to design multiple 2U (AS201-1N0, AS205-2T1)/4U (AS400-2A1) servers, including NVIDIA GH200 Grace Hopper Superchip, NVIDIA H200 NVL, and NVIDIA L40S accelerators. Among them, the NVIDIA H200 NVL unleashes AI acceleration for mainstream enterprise servers with up to 1.7X faster large language model (LLM) inference and 1.3X more performance on HPC applications over the H100 NVL.

3. The data center is actively seeking solutions to enhance computing density and efficiency. PEGATRON combines advanced (Direct-to-Chip) cooling solutions with the latest AMD EPYC™ 9005 series processors to create a multi-node, high-density OCP server (MS303-4A1) that meets ORv3 specifications. PEGATRON also showcased air-cooled multi-node servers (MS301-2T1, MS302-2T1), equipped with Intel® Xeon® 6 CPUs with E-cores and P-cores, which can meet the flexibility and energy saving requirements of data centers.